8 Layers ENIG/Immersion Gold+OSP
Layers：8
Board thickness：1.6mm
Minimum hole size：0.20mm
Inner layer Line Width/Space：Line Width:0.1mm, Line Space:0.1mm
Out layer Line Width/Space：Line Width:0.075mm, Line Space:0.075mm
Solder mask Bridge：0.1mm
Impedance Control：Differential Impedance
Surface Finishing：ENIG/Immersion Gold+OSP
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