4 Layers ENIG/Immersion Gold
Layers：4
Board thickness：1.2mm
Minimum hole size：0.20mm
Inner layer Line Width/Space：Line Width:0.127mm, Line Space:0.127mm
Out layer Line Width/Space：Line Width:0.1mm, Line Space:0.1mm
Solder mask Bridge：0.1mm
Surface Finishing：ENIG/Immersion Gold
Special Process:Impedance,Half plated holes
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